Specification
| Material Selection |
|
| Polyimide Films |
0.5 mil, 1 mil, 1.5mils, 2 mils |
| Thermobond Adhesives |
Polyimide |
| Copper Foils (RA or ED) |
ED: 1/3oz, 1/2oz, 1oz, 1.5oz, 2oz, 3oz, 4oz RA: 1/2oz, 1-4oz |
| Surface Finish |
electroplate nick-gold, chemical-plating nickel-gold, electroplate lead-tin, electroplate tin unleaded, chemical-plating tin, gushes out the tin, anti-oxidant |
| Tape Fixings |
Pressure Sensitive Adhesive (PSA) |
| Solder Resists |
Coverlay, Photo-Imageable Resist (PIR) |
| Capabilities |
|
| Number of Layers |
1-6 |
| Minimum Trace and Space* |
3mil&3mil (1oz copper) |
| Smallest Drill Size* |
0.2mm |
| Min. Annular Ring Width |
4mils |
| Total Thickness Of Part |
45~300¦Ìm |
| PTH Wall Copper Thickness |
0.025mm |
| Flexibility |
R=7, 180¡ã, no broken crease(single panel) at 100,000 times bending |
| Dielectric Performance |
>1000V/mm |
| Soldering performance |
260¡æ, 5S |
| Thermal Shock Resistance |
260¡æ, 10s |
| Peel-off Strength |
1.0N/mm |
| Tolerance |
|
| Hole Dia. Tolerance(PTH) |
¡À0.05mm |
| Hole Dia. Tolerance(NPTH) |
¡À0.08mm |
| Outline Tolerance |
¡À0.1mm |
| Miscellaneous |
|
| Arrangement of the line |
With side, different side, fretwork, etc |
| EMI countermeasure |
Copper screen, aluminium foil, copper screen wheat draw, aluminium foil wheat draw, conductive cloth, silver thick liquid disposing, suck wave material, etc |
| Flammability Rate |
94V-0 |
*For detailed info of our flexible circuit products, please contact us at sales@elecflex.com
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