Material
| Material |
Parameter |
| Polyimide Films |
0.5 mil, 1 mil, 1.5mils, 2 mils |
| Thermobond Adhesives |
Polyimide |
| Copper Foils (RA or ED) |
ED: 1/3oz, 1/2oz, 1oz, 1.5oz, 2oz, 3oz, 4oz RA: 1/2oz, 1-4oz |
| Surface Finish |
electroplate nick-gold, chemical-plating nickel-gold, electroplate lead-tin, electroplate tin unleaded, chemical-plating tin, gushes out the tin, anti-oxidant |
| Tape Fixings |
Pressure Sensitive Adhesive (PSA) |
| Solder Resists |
Coverlay, Photo-Imageable Resist (PIR) |
* Equivalent materials made in China are usually used on products to reduce cost under client's permission.
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